• DocumentCode
    1115443
  • Title

    On the Use of Structural Vibrations to Release Stiction Failed MEMS

  • Author

    Savkar, Amit A. ; Murphy, Kevin D. ; Leseman, Zayd C. ; Mackin, Thomas J. ; Begley, Matthew R.

  • Author_Institution
    Dept. of Mech. Eng., Connecticut Univ., Storrs, CT
  • Volume
    16
  • Issue
    1
  • fYear
    2007
  • Firstpage
    163
  • Lastpage
    173
  • Abstract
    This paper identifies dynamic excitation parameters that promote decohesion of stiction-failed microcantilevers. The dynamic response of "s-shaped" adhered beams subjected to harmonic loading is described using modal analysis; this model is then used to predict the onset of debonding in the context of a critical interface energy. These theoretical results are used to rationalize preliminary experiments, which illustrate that dynamic excitation may be used to affect partial or complete repair of stiction-failed microcantilevers. The theoretical results provide fundamental insight regarding regimes where resonant effects trigger debonding and can serve as a potential mechanism for stiction repair. The models illustrate that driving a structure at resonance is usually beneficial with regards to debonding. However, this is not universally true; there is no benefit to driving a device at frequencies with unfavorable mode-shapes. Thus, these results provide a reasonable physical and mathematical explanation for the preliminary experimental results, while providing a roadmap for identifying parameters in future tests
  • Keywords
    cantilevers; dynamic response; micromechanical devices; modal analysis; stiction; MEMS; critical interface energy; dynamic response; harmonic loading; microcantilevers; modal analysis; stiction failure; structural vibrations; trigger debonding; Adhesives; Context modeling; Mechanical engineering; Micromechanical devices; Modal analysis; Polymer films; Predictive models; Resonance; Student members; Vibrations; Repair; stiction failure; vibrations;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2006.885986
  • Filename
    4099380