• DocumentCode
    1115566
  • Title

    Efficient thermal modeling of SOI MOSFETs for fast dynamic operation

  • Author

    Lin, Jun ; Shen, Min ; Cheng, Ming-C ; Glasser, M. Lawrence

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Clarkson Univ., Potsdam, NY, USA
  • Volume
    51
  • Issue
    10
  • fYear
    2004
  • Firstpage
    1659
  • Lastpage
    1666
  • Abstract
    An efficient dynamic thermal model has been developed for silicon-on-insulator (SOI) MOSFETs. The model is derived from the variational principle using a thermal functional, and is able to describe extremely fast dynamic thermal behavior in SOI devices subjected to sudden changes in power generation. The developed model is further converted into a thermal circuit with time-varying thermal resistances and capacitances. With the circuit implemented in a circuit simulator, these time-varying thermal resistances and capacitances are able to reasonably capture extremely fast temperature evolution in SOI devices without including a large number of nodes. The developed dynamic thermal model and circuit are verified with the rigorous device simulation including self-heating.
  • Keywords
    MOSFET; circuit simulation; semiconductor device models; silicon-on-insulator; thermal resistance; variational techniques; MOSFET; SOI devices; circuit simulator; device simulation; dynamic thermal circuit; dynamic thermal model; fast dynamic operation; fast dynamic thermal behavior; power generation; self-heating; silicon-on-insulator; temperature evolution; thermal capacitance; thermal functional; thermal modeling; thermal resistance; time-varying thermal capacitances; time-varying thermal resistances; transient thermal circuit; variational principle; Analytical models; Capacitance; Circuit simulation; MOSFETs; Power generation; Semiconductor films; Silicon on insulator technology; Temperature; Thermal resistance; Transient analysis; Dynamic thermal model; SOI; self-heating; silicon-on-insulator; thermal capacitance; thermal resistance; transient thermal circuit;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2004.835994
  • Filename
    1337178