DocumentCode
1115752
Title
Reproducibility of electromigration measurements
Author
Schafft, Harry A. ; Staton, Tammy C. ; Mandel, J. ; Shott, John D.
Author_Institution
National Bureau of Standards, Gaithersburg, MD
Volume
34
Issue
3
fYear
1987
fDate
3/1/1987 12:00:00 AM
Firstpage
673
Lastpage
681
Abstract
The reproducibility of median-time-to-failure (t50 ) measurements was determined in an interlaboratory experiment in which 11 laboratories and a reference laboratory took part. Each laboratory used a method of its choosing to test equivalent samples under the same conditions of current density and oven temperature. The between-laboratory reproducibility of t50 measurements normalized to one metallization temperature was dependent on current-density stress: at 1.0 MA /cm2it was within 15 percent, while at 2.5 MA/cm2it was generally within 50 percent. The primary source for variability is in estimating the temperature rise of the test metallization due to joule heating. Recommendations are given for the design and test of electromigration test structures to improve the reproducibility of t50 measurements.
Keywords
Current density; Current measurement; Electromigration; Laboratories; Metallization; Ovens; Reproducibility of results; Stress measurement; Temperature; Testing;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1987.22979
Filename
1486690
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