• DocumentCode
    1115752
  • Title

    Reproducibility of electromigration measurements

  • Author

    Schafft, Harry A. ; Staton, Tammy C. ; Mandel, J. ; Shott, John D.

  • Author_Institution
    National Bureau of Standards, Gaithersburg, MD
  • Volume
    34
  • Issue
    3
  • fYear
    1987
  • fDate
    3/1/1987 12:00:00 AM
  • Firstpage
    673
  • Lastpage
    681
  • Abstract
    The reproducibility of median-time-to-failure (t50) measurements was determined in an interlaboratory experiment in which 11 laboratories and a reference laboratory took part. Each laboratory used a method of its choosing to test equivalent samples under the same conditions of current density and oven temperature. The between-laboratory reproducibility of t50measurements normalized to one metallization temperature was dependent on current-density stress: at 1.0 MA /cm2it was within 15 percent, while at 2.5 MA/cm2it was generally within 50 percent. The primary source for variability is in estimating the temperature rise of the test metallization due to joule heating. Recommendations are given for the design and test of electromigration test structures to improve the reproducibility of t50measurements.
  • Keywords
    Current density; Current measurement; Electromigration; Laboratories; Metallization; Ovens; Reproducibility of results; Stress measurement; Temperature; Testing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1987.22979
  • Filename
    1486690