• DocumentCode
    1116052
  • Title

    Scaling limits in batch-fabricated silicon pressure sensors

  • Author

    Chau, Hin-Leung ; Wise, Kensall D.

  • Author_Institution
    University of Michigan, Ann Arbor, MI
  • Volume
    34
  • Issue
    4
  • fYear
    1987
  • fDate
    4/1/1987 12:00:00 AM
  • Firstpage
    850
  • Lastpage
    858
  • Abstract
    The scaling properties of silicon capacitive and piezoresistive pressure sensors are described. An evaluation of the various noise mechanisms and pressure offsets in the scaled devices is presented, including Brownian noise, electrical noise, electrostatic pressure variations and pressure offset due to resistor mismatch. The analysis of diaphragm deflection includes the effects of intrinsic stress and the transition from plate theory to membrane theory. Both ultraminiature and ultrasensitive sensors are considered. Ultraminiature piezoresistive sensors with diaphragms measuring 100 µm in length and resolving 1 mmHg should be possible using present technology as well as ultrasensitive capacitive sensors that resolve 1 µmHg.
  • Keywords
    Boron; Capacitive sensors; Etching; Fabrication; Micromachining; Pressure measurement; Silicon; Stress; Substrates; Transducers;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1987.23006
  • Filename
    1486717