DocumentCode :
1116052
Title :
Scaling limits in batch-fabricated silicon pressure sensors
Author :
Chau, Hin-Leung ; Wise, Kensall D.
Author_Institution :
University of Michigan, Ann Arbor, MI
Volume :
34
Issue :
4
fYear :
1987
fDate :
4/1/1987 12:00:00 AM
Firstpage :
850
Lastpage :
858
Abstract :
The scaling properties of silicon capacitive and piezoresistive pressure sensors are described. An evaluation of the various noise mechanisms and pressure offsets in the scaled devices is presented, including Brownian noise, electrical noise, electrostatic pressure variations and pressure offset due to resistor mismatch. The analysis of diaphragm deflection includes the effects of intrinsic stress and the transition from plate theory to membrane theory. Both ultraminiature and ultrasensitive sensors are considered. Ultraminiature piezoresistive sensors with diaphragms measuring 100 µm in length and resolving 1 mmHg should be possible using present technology as well as ultrasensitive capacitive sensors that resolve 1 µmHg.
Keywords :
Boron; Capacitive sensors; Etching; Fabrication; Micromachining; Pressure measurement; Silicon; Stress; Substrates; Transducers;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1987.23006
Filename :
1486717
Link To Document :
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