DocumentCode
1116052
Title
Scaling limits in batch-fabricated silicon pressure sensors
Author
Chau, Hin-Leung ; Wise, Kensall D.
Author_Institution
University of Michigan, Ann Arbor, MI
Volume
34
Issue
4
fYear
1987
fDate
4/1/1987 12:00:00 AM
Firstpage
850
Lastpage
858
Abstract
The scaling properties of silicon capacitive and piezoresistive pressure sensors are described. An evaluation of the various noise mechanisms and pressure offsets in the scaled devices is presented, including Brownian noise, electrical noise, electrostatic pressure variations and pressure offset due to resistor mismatch. The analysis of diaphragm deflection includes the effects of intrinsic stress and the transition from plate theory to membrane theory. Both ultraminiature and ultrasensitive sensors are considered. Ultraminiature piezoresistive sensors with diaphragms measuring 100 µm in length and resolving 1 mmHg should be possible using present technology as well as ultrasensitive capacitive sensors that resolve 1 µmHg.
Keywords
Boron; Capacitive sensors; Etching; Fabrication; Micromachining; Pressure measurement; Silicon; Stress; Substrates; Transducers;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1987.23006
Filename
1486717
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