A new approach to thermal analysis of power devices

With ever-increasing requirements for higher power hybrid and integrated circuits, thermal design considerations and means for thermal analysis have become of fundamental importance. A new approach for analyzing the heat flow across devices and substrates is described. Semi-analytic solutions are derived within the context of a multilayer model. These solutions are amenable to straightforward computer evaluation and can serve as a basis for computer-aided design. Important features of the heat flow in the structures, such as thermal spreading and thermal coupling, are treated, and as an example, numerical computations of temperature distributions at the surface of a hybrid device are presented and compared with the experiment.