DocumentCode
1116950
Title
Specific contact resistivity measurement by a vertical Kelvin test structure
Author
Lei, Tan Fu ; Leu, Len Yi ; Lee, Chung Len
Author_Institution
National Chiao Tung University, Hsin Chu, Taiwan, Republic of China
Volume
34
Issue
6
fYear
1987
fDate
6/1/1987 12:00:00 AM
Firstpage
1390
Lastpage
1395
Abstract
A vertical Kelvin test structure is used to measure the specific contact resistivity of the Al (1-percent Si)/Si and Al (1-percent Si)/TiSi2 /Si contact system. For the vertical test structure, the driving current flows "vertically," thus the current crowdings and sheet resistance effects are eliminated and measurement on the true specific contact resistivity becomes possible. Experimental works show that results obtained by using this vertical structure are closer to the true specific contact resistivities than those obtained by using the conventional six-terminal Kelvin method. It is also found that Rsd , the sheet resistance directly underneath the contact pad, is much less than that of the conduction bar without the contact pad. A value of (1.17 ± 0.17) × 10-7Ω . cm2specific contact resistivity is obtained for the Al (1-percent Si) /TiSi2 (direct reaction) /Si system.
Keywords
Conductivity measurement; Contact resistance; Current measurement; Electrical resistance measurement; Kelvin; Metallization; Proximity effect; Semiconductor devices; System testing; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1987.23096
Filename
1486807
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