• DocumentCode
    1116950
  • Title

    Specific contact resistivity measurement by a vertical Kelvin test structure

  • Author

    Lei, Tan Fu ; Leu, Len Yi ; Lee, Chung Len

  • Author_Institution
    National Chiao Tung University, Hsin Chu, Taiwan, Republic of China
  • Volume
    34
  • Issue
    6
  • fYear
    1987
  • fDate
    6/1/1987 12:00:00 AM
  • Firstpage
    1390
  • Lastpage
    1395
  • Abstract
    A vertical Kelvin test structure is used to measure the specific contact resistivity of the Al (1-percent Si)/Si and Al (1-percent Si)/TiSi2/Si contact system. For the vertical test structure, the driving current flows "vertically," thus the current crowdings and sheet resistance effects are eliminated and measurement on the true specific contact resistivity becomes possible. Experimental works show that results obtained by using this vertical structure are closer to the true specific contact resistivities than those obtained by using the conventional six-terminal Kelvin method. It is also found that Rsd, the sheet resistance directly underneath the contact pad, is much less than that of the conduction bar without the contact pad. A value of (1.17 ± 0.17) × 10-7Ω . cm2specific contact resistivity is obtained for the Al (1-percent Si) /TiSi2(direct reaction) /Si system.
  • Keywords
    Conductivity measurement; Contact resistance; Current measurement; Electrical resistance measurement; Kelvin; Metallization; Proximity effect; Semiconductor devices; System testing; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1987.23096
  • Filename
    1486807