• DocumentCode
    1117409
  • Title

    A Model With Temperature-Dependent Exponent for Hot-Carrier Injection in High-Voltage nMOSFETs Involving Hot-Hole Injection and Dispersion

  • Author

    Dai, Mingzhi ; Gao, Chao ; Yap, Kinleong ; Shan, Yi ; Cao, Zigui ; Liao, Kuangyang ; Wang, Liang ; Cheng, Bo ; Liu, Shaohua

  • Author_Institution
    Chinese Acad. of Sci., Shanghai
  • Volume
    55
  • Issue
    5
  • fYear
    2008
  • fDate
    5/1/2008 12:00:00 AM
  • Firstpage
    1255
  • Lastpage
    1258
  • Abstract
    An improved hot-hole-involved interface-state generation model is proposed for hot-carrier injection (HCI) degradation in high-voltage (HV) nMOSFETs. This model is based on experiments over a wide range of temperatures, voltage conditions, simulation results, and the underlying physical mechanisms. The model provides a thorough picture of an HCI system in HV nMOSFETs, with hot-hole injection related to an additional maximum electric-field region. The hot-hole injection in HCI is assumed to introduce deeper localized hydrogen states in gate-oxide films than that in negative-bias temperature instabilities. This result facilitates the dispersive transport of hydrogen. Therefore, HCI degradation in HV transistors is explained within the framework of disorder-controlled hydrogen kinetics. The power-law model can successfully predict temperature dependences for HCI degradation.
  • Keywords
    MOSFET; charge injection; hot carriers; transistors; HCI degradation; HV transistor; gate-oxide film; high-voltage nMOSFET; hot-carrier injection; hot-hole dispersion; hot-hole injection; hot-hole-involved interface-state generation model; temperature; voltage condition; Degradation; Dispersion; Hot carrier injection; Hot carriers; Human computer interaction; Hydrogen; Kinetic theory; MOSFETs; Temperature distribution; Voltage; Degradation model; high-voltage (HV) transistor; hot-carrier-injection (HCI); hot-hole injection;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.919322
  • Filename
    4480167