• DocumentCode
    1117871
  • Title

    Semiconductor workbench for integrated modeling

  • Author

    Weckman, Jerry

  • Author_Institution
    Sematech, Austin, TX, USA
  • Volume
    17
  • Issue
    2
  • fYear
    1994
  • fDate
    6/1/1994 12:00:00 AM
  • Firstpage
    244
  • Lastpage
    248
  • Abstract
    Semiconductor workbench for integrated modeling (SWIM) is a project that was recently undertaken by SEMATECH in order to support the existing and future operational modeling needs of its semiconductor member companies. The objective of this workbench is to provide an open, integrated modeling framework that will support a number of different operational modeling applications (tools) interfaced to fab (semiconductor fabrication facility) C`2IM systems. The operational models referred to include applications in the following areas: discrete event simulation, flow and queue analysis, cost, capacity, plant layout, and scheduling. Additionally, these applications pertain to either the fab, cell, or equipment levels of abstraction. The objective of this paper is to describe the capabilities and benefits of the recently developed SWIM prototype
  • Keywords
    digital simulation; discrete event simulation; electronic engineering computing; integrated circuit manufacture; object-oriented methods; production control; production engineering computing; semiconductor device manufacture; semiconductor process modelling; C`2IM systems; SEMATECH; SWIM prototype; capacity; cost; discrete event simulation; flow analysis; integrated modeling; open integrated modeling framework; plant layout; queue analysis; scheduling; semiconductor fabrication facility; semiconductor workbench; Application software; Computer integrated manufacturing; Costs; Discrete event simulation; Manufacturing industries; Object oriented modeling; Packaging; Prototypes; Software prototyping; Virtual manufacturing;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.296405
  • Filename
    296405