The tradeoff between peripheral and area array bonding of components in multichip modules

Author

Sandborn, Peter A. ; Abadir, Magdy S. ; Murphy, Cynthia F.

Author_Institution

Microelectron. & Comput. Technol. Corp., Austin, TX, USA

Volume

17

Issue

2

fYear

1994

fDate

6/1/1994 12:00:00 AM

Firstpage

249

Lastpage

256

Abstract

This paper examines the tradeoff between peripheral I/O format die (for wirebonding, tape automated bonding (TAB), or peripheral flip chip bonding) and area array I/O format die (for flip chip bonding), as a function of partitioning a fixed functionality into a variable number of die. The comparison in this study has been made in the context of a multichip module (MCM). The analysis approach used concurrently considers module size, thermal and electrical performance, and cost (including module-level test and rework) to assess the overall applicability of one bonding format over the other

Keywords

flip-chip devices; lead bonding; multichip modules; tape automated bonding; I/O format die; MCM; TAB; area array bonding; cost; electrical performance; flip chip bonding; microassembly; module size; multichip modules; packaging; peripheral bonding; tape automated bonding; thermal performance; wirebonding; Cost function; Flip chip; Logic testing; Manufacturing; Multichip modules; Packaging; Performance analysis; Performance evaluation; System testing; Wafer bonding;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.296406

Filename

296406