• DocumentCode
    1117963
  • Title

    Au-Sb and Au-Ag-Sb alloys as low-voltage contact materials

  • Author

    Wang, Bor-Jenq ; Saka, Nannaji ; Rabinowicz, Ernest

  • Author_Institution
    Dept. of Mech. Eng., MIT, Cambridge, MA, USA
  • Volume
    17
  • Issue
    2
  • fYear
    1994
  • fDate
    6/1/1994 12:00:00 AM
  • Firstpage
    295
  • Lastpage
    302
  • Abstract
    A recent investigation has shown that the increase in contact resistance of low-voltage, noble-metal electrical contacts with the number of on-off switch cycles is primarily due to carbon formation on the contact surfaces. Moreover, when contact electrodes were made of the base metals Ni, Fe, Ti, or Sb, carbon formation was delayed, though not eliminated. Among these, Sb was found to be most effective against carbon formation. Because of its high electrical resistivity and poor oxidation resistance, however, pure Sb cannot be used for electrical contacts. Thus in this study Au-Sb and Au-Ag-Sb alloys of various compositions were prepared and tested to evaluate their carbon formation behavior. An impact tester that simulated the operation of electromechanical relay contacts was used, and experiments were conducted in an atmosphere of air-benzene mixture at room temperature. Of the alloys tested, the ternary Au-7Ag-30Sb alloy was found to be the best
  • Keywords
    antimony alloys; carbon; contact resistance; electrical contacts; gold alloys; silver alloys; surface phenomena; Au-Ag-Sb alloy; Au-Sb alloy; AuAgSb; AuSb; C formation prevention; LV contacts; air-benzene mixture atmosphere; contact resistance; contact surfaces; electromechanical relay contacts; impact tester; low-voltage contact materials; noble-metal electrical contacts; ternary Au-7Ag-30Sb alloy; Atmospheric modeling; Contact resistance; Delay; Electric resistance; Electrodes; Iron; Oxidation; Surface resistance; Switches; Testing;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.296413
  • Filename
    296413