DocumentCode
1119275
Title
News Briefs
Author
Paulson, Linda Dailey
Volume
40
Issue
9
fYear
2007
Firstpage
20
Lastpage
22
Abstract
A leading semiconductor design software-tool vendor has developed an approach that would increase chip performance by running wiring diagonally as well as horizontally and vertically, as is the case now - between transistors, on-chip memory, and other processor elements. This paper discusses the advantages of Candence´s X Architecture approach that uses wiring which runs diagonally along with the connections that run horizontally or vertically in some layers.
Keywords
circuit CAD; semiconductor devices; software tools; wiring; Candence X Architecture; diagonal wiring; semiconductor design; software-tool vendor; Energy efficiency; Fixtures; Integrated circuit interconnections; Lead compounds; Light emitting diodes; Routing; Semiconductor device manufacture; Tracking; Wires; Wiring; LED technology; herd computing; semiconductor technology; spyware; wireless technology;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/MC.2007.327
Filename
4302607
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