• DocumentCode
    1119275
  • Title

    News Briefs

  • Author

    Paulson, Linda Dailey

  • Volume
    40
  • Issue
    9
  • fYear
    2007
  • Firstpage
    20
  • Lastpage
    22
  • Abstract
    A leading semiconductor design software-tool vendor has developed an approach that would increase chip performance by running wiring diagonally as well as horizontally and vertically, as is the case now - between transistors, on-chip memory, and other processor elements. This paper discusses the advantages of Candence´s X Architecture approach that uses wiring which runs diagonally along with the connections that run horizontally or vertically in some layers.
  • Keywords
    circuit CAD; semiconductor devices; software tools; wiring; Candence X Architecture; diagonal wiring; semiconductor design; software-tool vendor; Energy efficiency; Fixtures; Integrated circuit interconnections; Lead compounds; Light emitting diodes; Routing; Semiconductor device manufacture; Tracking; Wires; Wiring; LED technology; herd computing; semiconductor technology; spyware; wireless technology;
  • fLanguage
    English
  • Journal_Title
    Computer
  • Publisher
    ieee
  • ISSN
    0018-9162
  • Type

    jour

  • DOI
    10.1109/MC.2007.327
  • Filename
    4302607