• DocumentCode
    1120367
  • Title

    Time-dependent degradation of thin gate oxide under post-oxidation high-temperature anneal

  • Author

    Lassig, S. ; Liang, M.S.

  • Author_Institution
    Peak Systems Inc., Fremont, CA
  • Volume
    8
  • Issue
    4
  • fYear
    1987
  • fDate
    4/1/1987 12:00:00 AM
  • Firstpage
    160
  • Lastpage
    161
  • Abstract
    Charge to breakdown QBDhas been used to evaluate the quality of thin gate oxides for some time. It is well known that the QBDof a thin oxide degrades with subsequent high-temperature thermal cycles. This paper reports on the time-dependent degradation of an 80-Å gate oxide at various post-oxidation annealing temperatures. An empirical relation was obtained as Q_{BD} \\propto \\exp (-A(T)t) where t is annealing time, T is annealing temperature, and A is the "rate constant" for the QBDdegradation. An Arrhenius plot of A versus 1/T yields an activation energy in the range of 6-7 eV. Also reported is the observation of an increase in QBDduring short annealing time which may be related to the relaxation of built-in stress induced during the oxidation process.
  • Keywords
    Annealing; Breakdown voltage; Current density; Design for quality; Monitoring; Oxidation; Solids; Temperature; Thermal degradation; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1987.26587
  • Filename
    1487137