DocumentCode
1120367
Title
Time-dependent degradation of thin gate oxide under post-oxidation high-temperature anneal
Author
Lassig, S. ; Liang, M.S.
Author_Institution
Peak Systems Inc., Fremont, CA
Volume
8
Issue
4
fYear
1987
fDate
4/1/1987 12:00:00 AM
Firstpage
160
Lastpage
161
Abstract
Charge to breakdown QBD has been used to evaluate the quality of thin gate oxides for some time. It is well known that the QBD of a thin oxide degrades with subsequent high-temperature thermal cycles. This paper reports on the time-dependent degradation of an 80-Å gate oxide at various post-oxidation annealing temperatures. An empirical relation was obtained as
where t is annealing time, T is annealing temperature, and A is the "rate constant" for the QBD degradation. An Arrhenius plot of A versus 1/T yields an activation energy in the range of 6-7 eV. Also reported is the observation of an increase in QBD during short annealing time which may be related to the relaxation of built-in stress induced during the oxidation process.
where t is annealing time, T is annealing temperature, and A is the "rate constant" for the QKeywords
Annealing; Breakdown voltage; Current density; Design for quality; Monitoring; Oxidation; Solids; Temperature; Thermal degradation; Thermal stresses;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1987.26587
Filename
1487137
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