Title :
Liquid dropping resin for IC encapsulation
Author :
Yamaoka, Shigenori ; Kusuhara, Akinobu ; Okabe, Yukihiro
Author_Institution :
Sumitomo Bakelite Co. Ltd., Kanagawa, Japan
fDate :
3/1/1988 12:00:00 AM
Abstract :
One method to encapsulate bare ICs on an organic substrate uses liquid epoxy resin. A type of liquid epoxy resin for use in tape automated bonding plastic leaded chip carrier, plastic-base pin grid array, and IC card is discussed. Epoxy resin used for this purpose should be of high reliability, comparable to that of the monolithic ICs which had not been realized on conventional resins used for chip-on-board applications. In order to meet these requirements, the characteristics of resin which yield high reliability, and methods to improve these characteristics have been studied. Effective factors which had been found to contribute to higher reliability are discussed
Keywords :
encapsulation; materials testing; packaging; reliability; COB; IC card; IC encapsulation; TAB PLCC; characteristics; chip-on-board applications; encapsulate bare ICs; liquid drip resin; liquid epoxy resin; organic substrate; plastic-base pin grid array; reliability; Bonding; Electrodes; Electronics packaging; Encapsulation; Epoxy resins; Humidity; Impurities; Integrated circuit testing; Plastics; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
