DocumentCode
1120619
Title
Technology ´88: Solid state
Author
Wollard, K.
Volume
25
Issue
1
fYear
1988
Firstpage
44
Lastpage
46
Abstract
Significant developments of 1987 are reviewed, namely, a truce in the chip war between the US and Japan; the arrival of 4 Mb chips, with the 16 Mb chips on the horizon; the growing market for application-specific ICs; refinements in floating-point digital signal processors; GaAs-on-silicon wafer; and high-density packaging for chips. An expert opinion is offered by W. David Price, a senior member of the technical staff of IBM´s semiconductor facility in Essex Junction, Vermont, who comments on a number of developments.<>
Keywords
digital integrated circuits; integrated circuit technology; 16 Mbit; 4 Mbit; GaAs-Si; Japan; US; application-specific ICs; floating-point digital signal processors; high-density packaging; solid state; Consumer electronics; EPROM; Electronics industry; Government; Manufacturing industries; Microprocessors; Production; Semiconductor device manufacture; Solid state circuits; Trade agreements;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/6.4483
Filename
4483
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