Abstract :
Significant developments of 1987 are reviewed, namely, a truce in the chip war between the US and Japan; the arrival of 4 Mb chips, with the 16 Mb chips on the horizon; the growing market for application-specific ICs; refinements in floating-point digital signal processors; GaAs-on-silicon wafer; and high-density packaging for chips. An expert opinion is offered by W. David Price, a senior member of the technical staff of IBM´s semiconductor facility in Essex Junction, Vermont, who comments on a number of developments.<>
Keywords :
digital integrated circuits; integrated circuit technology; 16 Mbit; 4 Mbit; GaAs-Si; Japan; US; application-specific ICs; floating-point digital signal processors; high-density packaging; solid state; Consumer electronics; EPROM; Electronics industry; Government; Manufacturing industries; Microprocessors; Production; Semiconductor device manufacture; Solid state circuits; Trade agreements;
