DocumentCode
1120821
Title
Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound
Author
Konzelmann, Simon ; Hoffmann, Christian ; Merte, Ralf ; Peier, Dirk
Author_Institution
Univ. of Dortmund, Dortmund
Volume
15
Issue
2
fYear
2008
fDate
4/1/2008 12:00:00 AM
Firstpage
327
Lastpage
333
Abstract
Epoxy resin compounds are manufactured with silica glass and aluminum nitride as filling material at various filling ratios. The thermal conductivity and electrical properties, like dielectric loss or electric strength, are measured and compared as regards to an utilization as electrical insulator.
Keywords
aluminium compounds; dielectric losses; electric strength; filled polymers; glass; silicon compounds; thermal conductivity; dielectric loss; electric strength; electrical properties; epoxy resin compounds; filling material; glass; thermal conductivity; Aluminum nitride; Conducting materials; Dielectric loss measurement; Dielectric losses; Dielectric materials; Epoxy resins; Filling; Glass manufacturing; Silicon compounds; Thermal conductivity;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2008.4483449
Filename
4483449
Link To Document