Title :
Design considerations for DC SQUIDs fabricated in deep sub-micron technology
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY
fDate :
3/1/1991 12:00:00 AM
Abstract :
Practical SQUIDs with well-coupled input coils of usable inductance have generally been fabricated at the 2-5 μm level of lithography. Other technologies, silicon in particular, are now routinely practised at the 0.5 μm level of lithography with impressive demonstrations at the 0.1-0.25 μm level not uncommon. The implications of applying such a fabrication capability to advance DC SQUID technology are explored. In particular, the issues of scaling practical DC SQUIDs down to the 0.1-0.25 μm regime are examined, using as a prototype design the basic washer SQUID with a spiral input coil. A technical path is mapped out that leads to a practical SQUID less than 0.05 mm2 in area with a tightly coupled 2-μH input coil, user-friendly voltage-flux characteristics, minimal flux creep related hysteresis, and coupled energy sensitivity approaching the quantum limit at 4.2 K
Keywords :
SQUIDs; integrated circuit technology; lithography; superconducting integrated circuits; 0.1 to 0.25 micron; 4.2 K; DC SQUID; deep sub-micron technology; fabrication; lithography; spiral input coil; submicron devices; superconducting junction devices; voltage-flux characteristics; washer SQUID; Coils; Creep; Fabrication; Inductance; Lithography; Prototypes; SQUIDs; Silicon; Spirals; Voltage;
Journal_Title :
Magnetics, IEEE Transactions on