• DocumentCode
    112143
  • Title

    Antiperovskite Manganese Nitride Standard Resistor

  • Author

    Oe, Takehiko ; Urano, Chiharu ; Kaneko, Nobu-hisa ; Eisaki, Hiroshi ; Yoshida, Yoshiyuki ; Yamamoto, Atsuhi ; Takenaka, Koshi

  • Author_Institution
    Nat. Inst. of Adv. Ind. Sci. & Technol., Nat. Metrol. Inst. of Japan, Tsukuba, Japan
  • Volume
    64
  • Issue
    6
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    1446
  • Lastpage
    1450
  • Abstract
    The antiperovskite manganese nitride compound Mn3Ag1-xCuxN has a broad resistivity-temperature curve around room temperature that is comparable with the Manganin alloy. This curvature and the peak temperature can be adjusted by codoping with Cu and In or Fe. The drift rate of the resistance value was strongly affected by the condition of the four-terminal contact and the shape of the sample. Samples with spot-welded contacts show lower resistance drift rates than samples with Ag-paste contacts. The four-terminal-shaped sample has a drift rate that is 80 times lower than the normal cuboid-shaped sample. We confirmed that the Mn3AgN sample has a sufficiently low-thermal electromotive force against copper that is less than a few microvolts per kelvin. We expect that this antiperovskite compound could be used as a material for precision resistors and could improve the temperature coefficient of resistors for developing metrology standards.
  • Keywords
    copper compounds; electrical resistivity; manganese compounds; measurement standards; resistors; silver compounds; Mn3Ag1-xCuxN; antiperovskite standard resistor; precision resistor; resistance value; resistivity-temperature curve; silver paste contact; thermal electromotive force; Annealing; Educational institutions; Immune system; Resistance; Resistors; Shape; Standards; Aging rate; Mn₃Ag₁₋ₓCuₓN; Mn3Ag1???xCuxN; Seebeck coefficient; antiperovskite compound; dc resistance standard; standard resistor; temperature coefficient of resistance (TCR); thermal electromotive force (EMF) against copper; thermal electromotive force (EMF) against copper.;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2014.2381732
  • Filename
    7000537