DocumentCode
1121430
Title
High-efficiency GaInAs Microwave MISFET´s
Author
Gardner, P.D. ; Bechtle, D. ; Narayan, S. Yegna ; Colvin, S.D. ; Paczkowski, J.
Author_Institution
David Sarnoff Research Center, Inc., Princeton, NJ
Volume
8
Issue
9
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
443
Lastpage
446
Abstract
GaInAs metal-insulator-semiconductor FET\´s (MISFET\´s) fabricated with a self-aligned-gate process and 1-µm gate lengths gave power outputs as high as 857 (1.53), 424 (0.76), 415 (0.74), and 114 mW (0.20 W/mm) at 4, 12, 20 and 32.5 GHz, respectively. Power-added efficiencies of 64.3 and 55.0 percent were obtained at 4 and 12 GHz, respectively. At 20 GHz, a power-added efficiency of 32.5 percent was obtained. The value of
calculated from measured scattering parameters (S parameters) was ∼ 45 GHz. This high cutoff frequency was validated by the measured performance at 32.5 GHz. We believe this to be the best microwave performance reported for GaInAs power transistors. A self-aligned-gate process, essential for minimizing gate overlap capacitances while maintaining a full-gate structure, that offers the potential for Submicrometer gate-length device fabrication is described.
calculated from measured scattering parameters (S parameters) was ∼ 45 GHz. This high cutoff frequency was validated by the measured performance at 32.5 GHz. We believe this to be the best microwave performance reported for GaInAs power transistors. A self-aligned-gate process, essential for minimizing gate overlap capacitances while maintaining a full-gate structure, that offers the potential for Submicrometer gate-length device fabrication is described.Keywords
Fabrication; Gallium arsenide; Indium phosphide; MISFETs; Metal-insulator structures; Metallization; Microwave FETs; Microwave devices; Scattering parameters; Substrates;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1987.26687
Filename
1487237
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