DocumentCode
1121546
Title
I-V Characteristics of oxygen-doped Si epitaxial film (OXSEF)/Si heterojunctions
Author
Takahashi, Mitsutoshi ; Tabe, Michiharu ; Sakakibara, Yutaka
Author_Institution
NTT, Atsugi-shi, Kanagawa, Japan
Volume
8
Issue
10
fYear
1987
fDate
10/1/1987 12:00:00 AM
Firstpage
475
Lastpage
476
Abstract
We have fabricated oxygen-doped Si epitaxial film (OX-SEF)/Si heterodiodes to examine device capabilities of the new wide-gap material, OXSEF. Various locations of the p-n junction with respect to the OXSEF/Si interface are achieved by changing the annealing time for arsenic diffusion from the implanted poly-Si layer on top of the OXSEF. When the p-n junction is located at the heterointerface, the diode n-value is 1.4-1.5 after H2 annealing. This can be reduced to 1.1-1.2 by pushing the p-n junction into a Si substrate of about 600 Å.
Keywords
Annealing; Conductivity; Cutoff frequency; Diodes; Heterojunctions; Hydrogen; P-n junctions; Semiconductor films; Substrates; Temperature;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1987.26699
Filename
1487249
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