DocumentCode :
1121581
Title :
Fully implanted InP JFET with an abrupt p+-n junction
Author :
Cheng, Chu-Liang ; Wang, Kou-Wei ; Parker, Sandra M.
Author_Institution :
AT&T Bell Laboratories, Murray Hill, NJ
Volume :
8
Issue :
10
fYear :
1987
fDate :
10/1/1987 12:00:00 AM
Firstpage :
483
Lastpage :
485
Abstract :
We report the first fully implanted InP junction field-effect transistor (JFET) with an abrupt p+-n junction. The device was made on a semi-insulating InP substrate with Si++implant for the n-channel and Be/P co-implant for the p+-region. A novel self-aligned process was used to reduce the gate-source spacing and thus minimize the series resistance. Good pinch-off characteristics and very low gate leakage current were obtained. The extrinsic transconductance is approximately 40 mS/mm for a gate length of 5 µm and a channel doping of 6 × 1016/cm3.
Keywords :
Doping; Etching; FETs; Fabrication; Implants; Indium gallium arsenide; Indium phosphide; Leakage current; Temperature; Transconductance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1987.26702
Filename :
1487252
Link To Document :
بازگشت