DocumentCode
1121679
Title
The Effects of a DC Power Layer in a 10-Nb-Layer Device for SFQ LSIs
Author
Akaike, Hiroyuki ; Shigehara, Keisuke ; Fujimaki, Akira ; Satoh, Tetsuro ; Hinode, Kenji ; Nagasawa, Shuichi ; Hidaka, Mutsuo
Author_Institution
Dept. of Quantum Eng., Nagoya Univ., Nagoya, Japan
Volume
19
Issue
3
fYear
2009
fDate
6/1/2009 12:00:00 AM
Firstpage
594
Lastpage
597
Abstract
We have evaluated the effects of a DC power (DCP) layer in a 10-Nb-layer device using SQUIDs and large-scale Josephson transmission lines (LS-JTLs). The 10-Nb-layer device has recently been developed for SFQ LSIs, with an active layer including Josephson junctions (JJs) at the top, two passive transmission line layers in the middle, and the DCP layer for bias current feeds at the bottom. The evaluation with SQUIDs revealed that the 10-Nb-layer device structure drastically reduced the magnetic flux induced by DC currents flowing through the DCP line, in comparison with the previous advanced process device structure. A major factor for this reduction was an increase in the number of ground layers between the DCP layer and the active layer. In the test of the LS-JTLs containing about 12000 JJs, we obtained the operating margins as wide as numerically simulated ones. We also observed no difference in the margins between a method for extracting ground return currents through ground layers and that through the dedicated layer. These results demonstrated that the 10-Nb-layer device structure is suitable for SFQ-LSIs.
Keywords
SQUIDs; large scale integration; magnetic flux; niobium; superconducting logic circuits; superconducting transmission lines; DC power layer effect; Josephson junction; Nb; SFQ LSI; SQUID; advanced process device structure; bias current; ground return current; large-scale Josephson transmission line; magnetic flux; passive transmission line layer; single flux quantum circuit; Device structure; large-scale SFQ circuits; magnetic fields; ten-Nb-layer device;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2009.2018033
Filename
5152997
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