Title :
Cryogenic Semiconductor Amplifier for RSFQ-Circuits With High Data Rates at 4.2 K
Author :
Wuensch, Stefan ; Ortlepp, Thomas ; Crocoll, Erich ; Uhlmann, Friedrich Hermann ; Siegel, Michael
Author_Institution :
Inst. for Micro- & Nanoelectronic Syst., Univ. of Karlsruhe, Karlsruhe, Germany
fDate :
6/1/2009 12:00:00 AM
Abstract :
The connection of RSFQ circuits with commercial room temperature electronics and amplifying SFQ pulses with high data rates require cryogenic interface amplifiers. Such amplifiers should provide extremely high bandwidth, low noise and low power consumption at the same time. Various hybrid amplifiers based on commercial p-HEMT transistors in an embedded microwave design were designed and characterized. Towards the p-HEMT transistor characterization at cryogenic temperature the biasing settings according to an optimum between voltage gain and low power consumption were determined. Thus a total power consumption of 2 mW and a voltage gain of 12 dB per single stage were achieved. For a preamplifier and an amplifier concept a multiple number of these stages were implemented in a microstrip and a coplanar transmission line design with a special matched interconnect taper towards the RSFQ components. Measurements of the amplifiers, the combination of an amplifier with a RSFQ circuit at 4.2 K showed their good performances without any disturbance of the RSFQ circuit. Due to the losses between the stages a total gain of 25 dB with a four stage amplifier was achieved; pulse rates went up to 3 Gb/s. The total power consumption was in the range of 8 mW. Further increase of data rates will be achieved by improving the matching between RSFQ output stage and amplifier.
Keywords :
amplifiers; cryogenic electronics; high electron mobility transistors; superconducting logic circuits; RSFQ-circuit; bandwidth; commercial pHEMT transistors; commercial room temperature electronic; coplanar transmission line design; cryogenic interface amplifiers; cryogenic semiconductor amplifier; cryogenic temperature; embedded microwave design; gain 12 dB; gain 25 dB; low power consumption; matched interconnect taper; microstrip transmission line; power 2 mW; power 8 mW; temperature 293 K to 298 K; temperature 4.2 K; voltage gain; High-speed interface; RSFQ; microwave amplifier;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2009.2018425