A fully integrated multiband MIMO WLAN transceiver RFIC

Author

Rahn, David G. ; Cavin, Mark S. ; Dai, Fa Foster ; Fong, Neric H W ; Griffith, Richard ; Macedo, José ; Moore, A. David ; Rogers, John W M ; Toner, Mike

Author_Institution

RFMD, Greensboro, NC, USA

Volume

40

Issue

8

fYear

2005

Firstpage

1629

Lastpage

1641

Abstract

A multiple-input/multiple-output (MIMO) transceiver RFIC compliant with IEEE 802.11a/b/g and Japan wireless LAN (WLAN) standards is presented. The transceiver has two complete radio paths integrated on the same chip. When two chips are used in tandem to form a four-path composite beam forming (CBF) system, 15 dB of link margin improvement is obtained. The transceiver was implemented in a 47-GHz SiGe technology with 29.1-mm² die size. It consumes 195 mA in RX mode and 240 mA in TX mode from a 2.75-V supply.

Keywords

MIMO systems; MMIC; transceivers; wireless LAN; 195 mA; 2.75 V; 240 mA; 47 GHz; IEEE 802.11a; IEEE 802.11b; IEEE 802.11g; MMIC; SiGe; SiGe technology; four-path composite beam forming system; multiband MIMO WLAN transceiver RFIC; multiple-input-multiple-output transceiver RFIC; Germanium silicon alloys; MIMO; Power system reliability; Radiofrequency integrated circuits; Silicon germanium; Telecommunication network reliability; Throughput; Transceivers; Wireless LAN; Wireless communication; 802.11 a/b/g; RFIC; SiGe; multiple-input/multiple-output (MIMO); transceivers; wireless LAN (WLAN); wireless communications;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/JSSC.2005.852419

Filename

1487606