• DocumentCode
    1122558
  • Title

    Josephson Junctions With Centered Step and Local Variation of Critical Current Density

  • Author

    Weides, M.

  • Author_Institution
    Inst. of Solid State Res., JARA-Fundamentals of Future Inf. Technol., Julich, Germany
  • Volume
    19
  • Issue
    3
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    689
  • Lastpage
    692
  • Abstract
    Superconductor-insulator-ferromagnet-superconductor (SIFS) Josephson tunnel junctions based on Nb/Al2O3/NiCu/Nb stacks with a thickness step in the metallic NiCu interlayer were fabricated. The step height of a few 0.1 nm was defined by optical lithography and controlled etching of both Nb and NiCu layers. Experimentally determined junction parameters by current-voltage characteristics and Fraunhofer pattern indicate a uniform NiCu thickness and similar interface transparencies for etched and non-etched parts. The critical current diffraction pattern was calculated and measured for stepped junctions having the same ground phase difference but different critical current densities in both halves. The measured data show a good agreement with simulations.
  • Keywords
    Josephson effect; alumina; copper alloys; critical current density (superconductivity); etching; ferromagnetic materials; magnetic multilayers; magnetic thin films; nickel alloys; niobium; superconducting thin films; superconductor-insulator-superconductor devices; Fraunhofer pattern; Josephson tunnel junction; Nb-Al2O3-NiCu-Nb; SIFS; controlled etching; critical current diffraction pattern; current-voltage characteristics; interface transparency; metallic NiCu interlayer; optical lithography; stepped junctions; superconductor-insulator-ferromagnet-superconductor; thin film; Ferromagnetic materials; Josephson junctions; superconducting device fabrication; thin films;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2009.2019049
  • Filename
    5153077