DocumentCode
112297
Title
Power Admission Control With Predictive Thermal Management in Smart Buildings
Author
Jianguo Yao ; Costanzo, Giuseppe Tommaso ; Guchuan Zhu ; Bin Wen
Author_Institution
Sch. of Software, Shanghai Jiao Tong Univ., Shanghai, China
Volume
62
Issue
4
fYear
2015
fDate
Apr-15
Firstpage
2642
Lastpage
2650
Abstract
This paper presents a control scheme for thermal management in smart buildings based on predictive power admission control. This approach combines model predictive control with budget-schedulability analysis in order to reduce peak power consumption as well as ensure thermal comfort. First, the power budget with a given thermal comfort constraint is optimized through budget-schedulability analysis which amounts to solving a constrained linear programming problem. Second, the effective peak power demand is reduced by means of the optimal scheduling and cooperative operation of multiple thermal appliances. The performance of the proposed control scheme is assessed by simulation based on the thermal dynamics of a real eight-room office building located at Danish Technical University.
Keywords
buildings (structures); domestic appliances; linear programming; power consumption; power control; power generation scheduling; predictive control; Danish Technical University; budget-schedulability analysis; constrained linear programming problem; cooperative operation; model predictive control; multiple thermal appliances; optimal scheduling; power consumption; power demand; predictive power admission control; predictive thermal management; real eight-room office building; smart buildings; thermal comfort constraint; thermal dynamics; Image registration; Image resolution; Joints; Magnetic resonance imaging; Mutual information; Splines (mathematics); Three-dimensional displays; Budget schedulability; Smart Grid; Smart buildings; budget-schedulability; demand response; model predictive control; model predictive control (MPC); smart buildings; smart grid;
fLanguage
English
Journal_Title
Industrial Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0278-0046
Type
jour
DOI
10.1109/TIE.2014.2387091
Filename
7000567
Link To Document