DocumentCode
1124103
Title
Trade-offs and challenges of short channel design on millimetre-wave power performance of GaN HFETs
Author
Sun, Y. ; Eastman, L.F.
Author_Institution
Dept. of Electr. & Comput. Eng., Cornell Univ., Ithaca, USA
Volume
41
Issue
15
fYear
2005
fDate
7/21/2005 12:00:00 AM
Firstpage
854
Lastpage
855
Abstract
For the application of undoped AlGaN/GaN HFETs to Ka-band millimetre(mm)-wave high frequency power performance, the maximum frequency of oscillation, fmax, was found to be seriously limited by gate resistance and output conductance with the gate length down to 0.1 μm. This makes it difficult for devices to achieve both high fT and fmax at the same time. However, the technology of field-plate gate, to increase device breakdown voltage, will add extra gate capacitance. It makes the optimum gate structure design more important. The influence of gate metal thickness and gate length on fmax based on the lumped small signal circuit model analysis and the possibility to obtain high fT and fmax simultaneously for the GaN material structure is discussed for application to the Ka-band mm-wave operating system.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; junction gate field effect transistors; millimetre wave field effect transistors; millimetre wave power transistors; semiconductor device breakdown; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; Ka band; device breakdown voltage; field-plate gate; gate capacitance; gate length; gate metal thickness; gate resistance; gate structure design; high frequency power performance; material structure; millimeter wave HFET; oscillation frequency; short channel design; signal circuit model analysis;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20051640
Filename
1487747
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