DocumentCode :
1124266
Title :
Reduction of AC Losses in Bi-2223 Tapes by Introducing Interfilamentary Oxide Barriers
Author :
Inada, Ryoji ; Mitsuno, Yoshiki ; Soguchi, Kazuma ; Nakamura, Yuichi ; Oota, Akio ; Li, Chengshan ; Zhang, Pingxiang
Author_Institution :
Dept. of Electr. & Electron. Eng., Toyohashi Univ. of Technol., Toyohashi, Japan
Volume :
19
Issue :
3
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
3018
Lastpage :
3021
Abstract :
AC loss reduction in Bi-2223 tapes is one of the key issues for the realization of power cables and transformers. The large loss generation is mainly attributed to the strong electromagnetic coupling between the filaments in AC external magnetic field. In this paper, we fabricated twisted Bi-2223 tapes with interfilamentary oxide barrier and evaluate their AC loss properties. To suppress the side effect on Bi-2223 phase formation during sintering, Ca2CuO3 or SrZrO3 powders were used as barrier materials. Furthermore, small amounts of Bi-2212 powders were mixed with them to improve their ductility for cold working. AC loss characteristics were examined at 77 K in parallel and perpendicular transverse magnetic fields with various field amplitudes and frequencies. The effect of introducing different oxide barriers on AC loss reduction at different operating condition is discussed.
Keywords :
bismuth compounds; calcium compounds; cold working; ductility; electrical resistivity; high-temperature superconductors; lead compounds; powders; sintering; strontium compounds; superconducting tapes; (BiPb)2Sr2Ca2Cu3O10; AC loss reduction; Ca2CuO3-Bi2Sr2CaCu2O8; SrZrO3-Bi2Sr2CaCu2O8; barrier materials; cold working; ductility; electromagnetic coupling; external magnetic field; interfilamentary oxide barriers; powders; power cables; sintering; superconducting tapes; temperature 77 K; transformers; transverse magnetic fields; AC loss; Bi-2223 tapes; filament twisting; interfilamentary barriers;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2009.2018187
Filename :
5153242
Link To Document :
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