New efficient method of modeling electronics packages with layered power/ground planes

The modeling of electrical performances of electronics packages is very important for the design of advanced packaging technology. However, it is also one of the most difficult tasks. This paper introduces a new efficient boundary integral equation technique for the modeling of electromagnetic fields in electronics packages. This approach dramatically reduces the computation requirement and can be conveniently integrated with circuit solvers. Skin-effect loss from the metal planes, dielectric loss from the substrate, together with the nonperfect reflections from the perimeter of planes and their frequency-dependent characteristics can all be taken into account. Correlation performed on test printed circuit boards shows good agreement between the measurement and the numerical results up to several GHz.