An X-band small outline leaded plastic package for MMIC applications

Author

Jessie, Darryl ; Larson, Lawrence E.

Author_Institution

Univ. of California, USA

Volume

25

Issue

3

fYear

2002

fDate

8/1/2002 12:00:00 AM

Firstpage

439

Lastpage

447

Abstract

A new small outline (SO) leaded plastic package has been developed that improves return loss, insertion loss, and isolation performance over that of a shrink small outline package (SSOP) in the same body size. A custom TRL calibration kit was developed, and prototype packages built and measured. The measured package showed an increase in the application bandwidth of SO-type packages from 5 GHz to over 8 GHz. Further investigations using full-wave electromagnetic simulations reveal a potential increase in return loss of better than 30 dB to 10 GHz, giving the package a usable bandwidth well into the X-band (8-12GHz). Applications for the new package are in microwave and RFIC applications.

Keywords

MMIC; calibration; capacitance; coplanar waveguides; equivalent circuits; integrated circuit packaging; losses; plastic packaging; 8 GHz; 8 to 12 GHz; CPW; MMIC applications; RFIC applications; SO-type packages; X-band package; custom TRL calibration kit; full-wave electromagnetic simulations; insertion loss; isolation performance; return loss; small outline leaded plastic package; Bandwidth; Calibration; Electromagnetic measurements; Insertion loss; Integrated circuit packaging; MMICs; Pins; Plastic packaging; Prototypes; Radiofrequency integrated circuits;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2002.806738

Filename

1166581