Title :
Development of Cu Substrate for Low Cost Coated Conductors
Author :
Kashima, Naoji ; Shima, Kunihiro ; Doi, Toshiya ; Kubota, Shuichi ; Watanabe, Tomonori ; Inoue, Masayoshi ; Kiss, Tananobu ; Nagaya, Shigeo
Author_Institution :
Chubu Electr. Power Co., Inc., Nagoya, Japan
fDate :
6/1/2009 12:00:00 AM
Abstract :
A textured Cu {100} lang001rang substrate for practical use in low cost coated conductor applications has been successfully fabricated. A textured Cu substrate is a promising substrate for a coated conductor template. This is the result of a low material cost base, no magnetization loss and good electro conductivity. One of the issues for a Cu substrate is surface oxidation. During REBCO deposition, the Cu substrate is exposed to an oxygen atmosphere, and de-lamination of the buffer layer can occur. To prevent this issue a thin Ni layer was formed on the textured Cu substrate by electroplating. After a further annealing process the Ni electroplated Cu substrates exhibit a good sharp texture and a smoother surface. The Deltaphi and Deltaomega of the substrate were about 4.6 and 4.5 degrees, respectively. The surface roughness was estimated at 6.8 nm Ra by AFM. Using this substrate and clad type Cu/SUS316 substrates, we deposited a CeO2/YSZ/CeO2 layer by pulsed laser deposition (PLD) and an YBa2Cu3O7-delta layer by PLD and metal-organic chemical vapor deposition (MOCVD). The results show no occurrence of de-lamination. Typical critical temperature of the coated conductors was 90.5 K and critical current density was a maximum of 4.5 MA/cm2 (at 77 K in a self-field).
Keywords :
MOCVD; MOCVD coatings; annealing; atomic force microscopy; barium compounds; cerium compounds; copper; critical current density (superconductivity); electroplated coatings; electroplating; high-temperature superconductors; metallic thin films; nickel; pulsed laser deposition; substrates; superconducting thin films; superconducting transition temperature; surface roughness; surface texture; yttrium compounds; zirconium compounds; AFM; CeO2-Y2O3-ZrO2-CeO2; Cu; MOCVD; Ni; PLD; REBCO deposition; YBa2Cu3O7-delta; annealing; clad type Cu-SUS316 substrates; coated conductors; critical current density; critical temperature; electroplating; metal-organic chemical vapor deposition; pulsed laser deposition; surface roughness; surface texture; temperature 77 K; textured Cu {100} lang001rang substrate; thin Ni layer; Coated conductor; Cu substrate; MOCVD; Ni-electroplating; PLD; YBCO; textured substrate;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2009.2018263