Enhancement of underfill capillary flow in flip-chip packaging by means of the inertia effect

This paper describes how the use of inertia forces induced by the rotation of a working disk may be adopted to increase the fill rate of the flip-chip packaging process and thereby reduce the process cycle time. It is shown how the driving forces resulting from the inertia effect are determined by the Weber number. The constant and varying contact angle models are compared under a specified set of process conditions. The calculated flow behavior results indicate that the relationship between the contact angle, the average fluid velocity, the liquid-air interface position, and the filling time depends upon the Weber number. The constant and varying contact angle models are utilized in the analysis of a new processing method referred to as rotation-enhanced underfill packaging (REUP). The inertia effect induced by the angular motion of the working disk is shown to enhance the flow of the underfill encapsulant and to reduce the time of the underfill process. The present results confirm that the rotation of the working disk leads to an increased underfill capillary flow rate, which is beneficial in reducing the production cycle time of the flip-chip packaging process.