DocumentCode :
1125185
Title :
Surface electrostatic damage by microprocess robotic machines: diagnosis and reliability, process auditing, and remedies
Author :
Jacob, Peter ; Nicoletti, Giovanni
Author_Institution :
Dept. of Electron./Metrol., Empa Swiss Fed. Labs. for Mater. Testing & Res., Duebendorf
Volume :
6
Issue :
2
fYear :
2006
fDate :
6/1/2006 12:00:00 AM
Firstpage :
213
Lastpage :
220
Abstract :
Electrostatic discharge (ESD) is generally known as a discharge phenomena via device pins. Many precautions have been taken against ESD, mostly considering workplace protection, pad protection structures. However, electrostatic events, originating from robotic semiconductor wafer- and device-processing seems at least a problem of similar severeness, which has not been considered enough, yet. This paper describes electrostatic mechanisms in most common assembly process tools, how to do diagnostics on devices and tool auditing. Auditing experiences are listed and hints how to improve tool-related ESD are described
Keywords :
assembling; electrostatic discharge; semiconductor device manufacture; semiconductor device reliability; assembly process tools; device pins; device-processing; electrostatic discharge; electrostatic mechanisms; microprocess robotic machines; pad protection structures; process auditing; robotic semiconductor wafer; semiconductor device fabrication; surface electrostatic damage; workplace protection; Assembly; Electrostatic discharge; Employment; Head; Liquid crystal devices; Optical microscopy; Passivation; Protection; Robots; Testing; Assembly systems; electrostatic discharge (ESD); semiconductor device fabrication;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2006.877863
Filename :
1673713
Link To Document :
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