• DocumentCode
    1125577
  • Title

    Fabrication of a 12-bit A/D converter using Nb/AlOx/Nb Josephson junctions

  • Author

    Kang, Joonhee ; Miller, Donald L. ; Przybysz, John X. ; Janocko, Michael A.

  • Author_Institution
    Westinghouse Electr. Corp., Pittsburgh, PA, USA
  • Volume
    27
  • Issue
    2
  • fYear
    1991
  • fDate
    3/1/1991 12:00:00 AM
  • Firstpage
    3117
  • Lastpage
    3120
  • Abstract
    For reliable fabrication of Nb/AlOx/Nb Josephson integrated circuits, a combination of anodization and reactive ion etching techniques was used to make various sizes of high-quality Nb/AlO x/Nb Josephson tunnel junctions with Jc as high as 5000 A/cm2 and Vm(2 mV) as large as 60 mV at 4.2 K. A ten-level process on Nb/AlOx/Nb trilayers with Jc of 1500 A/cm2 was used to fabricate a functional 12-b A/D converter. This circuit included 2.7-μm-diameter junctions defined by anodization and 5-μm-diameter junctions defined by reactive ion etching using Nb2O5 and Al as etch stops. A lift-off process with image-reversal photoresist was used to define SiO2 insulators, Mo resistors, and Au resistors. Mo resistor values were adjusted by reactive ion etching. Measurements of the completed circuit show that all circuit components had correct values to well within design tolerance
  • Keywords
    aluminium compounds; analogue-digital conversion; anodisation; integrated circuit technology; niobium; sputter etching; superconducting integrated circuits; superconducting junction devices; 12 bit; 2.7 micron; 4.2 K; 5 micron; 60 mV; Al as etch stops; Au resistors; Josephson integrated circuits; Josephson junctions; Mo resistors; Nb-AlOx-Nb; Nb2O5 etch stops; SiO2 insulators; anodization; fabrication; image-reversal photoresist; lift-off process; reactive ion etching; ten-level process; trilayers; Argon; Artificial intelligence; Cooling; Fabrication; Josephson junctions; Niobium; Oxidation; Sputtering; Substrates; Surface morphology;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.133995
  • Filename
    133995