Title :
"On the ionization of air for removal of noxious effluvia" (Air ionization of indoor environments for control of volatile and particulate contaminants with nonthermal plasmas generated by dielectric-barrier discharge)
Author :
Daniels, Stacy L.
Author_Institution :
Quality Air of Midland Inc., MI, USA
fDate :
8/1/2002 12:00:00 AM
Abstract :
Recent developments in the application of controllable air ionization processes that apply dielectric-barrier discharge devices to generate nonthermal plasmas have led to applications for chemical and biological decontamination in indoor air environments. These include significant reductions in airborne microbials, neutralization of odors, and reductions of specific volatile organic compounds (VOCs). Removal of very fine particulates (PMx) is also is enhanced by air ionization. The process of air ionization involves the electronically induced formation of small air ions, including reactive oxygen species, such as superoxide O2·-, the diatomic oxygen radical anion, which react rapidly with airborne VOC and PMx. The physics and chemistry of air ionization, and its utility for contributing to significant improvements in indoor air quality are discussed.
Keywords :
air pollution control; biological effects of fields; biological techniques; cellular biophysics; discharges (electric); plasma chemistry; plasma dielectric properties; plasma materials processing; O2; O2·-; air ionization; airborne microbials; biological decontamination; chemical decontamination; chemical reductions; diatomic oxygen radical anion; dielectric barrier discharge; electronically induced formation; indoor air quality; indoor environments; microbes; nonthermal plasma generation; noxious effluvia removal; odour neutralization; particulate contaminants; reactive oxygen species; small air ions; superoxide; very fine particulates; volatile contaminants; volatile organic compounds; Biological control systems; Chemical processes; Decontamination; Dielectric devices; Indoor environments; Ionization; Plasma applications; Plasma chemistry; Plasma devices; Process control;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2002.804211