Title :
A review of electrocoupling mechanisms mediating facilitated wound healing
Author_Institution :
Dept. of Bioeng., Univ. of Illinois, Chicago, IL, USA
fDate :
8/1/2002 12:00:00 AM
Abstract :
The role of electrical interaction in wound healing has been recognized for nearly half of the last century. Based on the notion that wound healing may be facilitated by using electrical stimulation (referred to as electrotherapy), numerous animal model studies and clinical trials have been carried out to establish the effectiveness of electrotherapy. In spite of the concentrated effort, however, electrotherapy has not been approved by the U.S. FDA and remains poorly understood. Elucidation of the molecular and cellular mechanisms mediating facilitated wound healing is likely required, before rational electrotherapy can be devised and successfully implemented. Over the past six years, we have performed a series of in vitro experiments designed to identify the mechanisms mediating the cellular effects induced by exogenous application of electrical stimulation. The purpose of this review is to provide a description for such mechanisms (i.e., electrocoupling mechanisms) and to formulate an integrated model for these coupling mechanisms.
Keywords :
bioelectric phenomena; patient treatment; skin; animal model; cell-surface receptor; cellular mechanisms; clinical trials; electrical interaction; electrical stimulation; electrocoupling mechanisms; electrotherapy; exogenous application; extracellular matrix; facilitated wound healing mediation; fluorescence recovery; focal adhesion complex; in vitro experiments; integrated model; intracellular calcium ion concentration; laser-optical tweezer; membrane electrical potential; molecular mechanisms; phospholipase C; photobleaching; single-particle tracking; stretch-activated cation channel; voltage-gated calcium channel; Animals; Biomedical engineering; Calcium; Clinical trials; Electrical stimulation; Electrochemical machining; Extracellular; Frequency; In vitro; Wounds;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2002.804200