Title :
Scalar magnetostatic potential approach to the prediction of the excess inductance of grounded via´s and via´s through a hole in a ground plane
Author :
Kok, Peter A. ; Zutter, Daniel De
Author_Institution :
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
fDate :
7/1/1994 12:00:00 AM
Abstract :
A quasi-static method is described for calculating the excess inductance of via´s. The considered via geometry contains connecting strips, pads on the via, and a finite ground plane thickness. An integral equation based on the scalar magnetic potential ψ is solved. The inductance is found by calculating the magnetic flux through a cut introduced to define ψ in an unequivocal way. The problem is generally solved for via through-holes; the grounded via-configuration is found as a limiting case. The influence of the geometric parameters on the via inductance is examined
Keywords :
inductance; magnetic flux; magnetostatics; printed circuit design; connecting strips; excess inductance; finite ground plane thickness; geometric parameters; ground plane; grounded via; inductance; integral equation; magnetic flux; quasi-static method; scalar magnetic potential; scalar magnetostatic potential; via geometry; via inductance; via through-holes; Capacitance; Dielectric substrates; Geometry; Inductance; Integral equations; Joining processes; Magnetic flux; Magnetostatics; Microstrip; Printed circuits;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on