DocumentCode :
1127227
Title :
Proposed ultrahigh frequency microstrip utilising buried silicide groundplane
Author :
Goosen, K.W. ; White, A.E. ; Short, K.T.
Author_Institution :
AT&T Bell Labs., Holmdel, NJ, USA
Volume :
26
Issue :
1
fYear :
1990
Firstpage :
49
Lastpage :
50
Abstract :
Recently it has become possible to produce buried single-crystal silicide layers in silicon on which epitaxial silicon may be grown. The authors show that if such a layer is used as a groundplane in a microstrip configuration, ultra-high-speed signals (e.g. 100 GHz) can be propagated with far less dispersion than on standard microstrip, by virtue of the close proximity of the groundplane to the centre conductor.
Keywords :
MMIC; digital integrated circuits; integrated circuit technology; microwave integrated circuits; strip line components; strip lines; 100 GHz; IC interconnect; MMIC; buried silicide groundplane; microstrip; microwave IC; ultra-high-speed signals;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19900032
Filename :
44868
Link To Document :
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