• DocumentCode
    1128603
  • Title

    Effect of physical aging on dielectric, thermal and mechanical properties of cast-epoxy insulators

  • Author

    Li, Y. ; Unsworth, J.

  • Author_Institution
    Center for Mater. Technol., Univ. of Technol., Sydney, NSW, Australia
  • Volume
    1
  • Issue
    1
  • fYear
    1994
  • fDate
    2/1/1994 12:00:00 AM
  • Firstpage
    9
  • Lastpage
    17
  • Abstract
    Samples of cast bisphenol-A and cycloaliphatic epoxy insulation were quenched from a temperature above Tg (170°C) to room temperature. Variations in dielectric, thermal and mechanical properties were examined during subsequent sub-Tg annealing (physical aging). It was found that the impact strength of the epoxy insulation decreased considerably with physical aging. Moisture intake and subsequent dielectric loss at room temperature were also found to decrease with physical aging. Glass transition temperature and excess enthalpy measured by DSC demonstrated significant increase with increased sub-Tg annealing. On the other hand, dielectric properties showed different changing patterns during sub-Tg annealing in different epoxy systems. It is concluded that epoxy insulating materials should be properly annealed before assessing their dielectric and other physical properties because of the possibility of unknown rapid cooling histories
  • Keywords
    ageing; annealing; calorimetry; dielectric losses; insulation testing; life testing; organic insulating materials; quenching (thermal); DSC; annealing; bisphenol-A; cast-epoxy insulators; cycloaliphatic epoxy; dielectric loss; dielectric properties; epoxy insulating materials; excess enthalpy; glass transition temperature; mechanical properties; physical aging; rapid cooling histories; thermal properties; Aging; Annealing; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Glass; Mechanical factors; Moisture; Temperature;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/94.300227
  • Filename
    300227