Title :
A study of dielectric relaxation in aluminosilicate-filled low-density polyethylene
Author :
Yin, Weijun ; Tanaka, John ; Damon, Dwight H.
Author_Institution :
Electr. Insulation Res. Center, Connecticut Univ., Storrs, CT, USA
fDate :
4/1/1994 12:00:00 AM
Abstract :
Space charge formation in low-density polyethylene (LDPE) filled with zeolites and clays has been investigated by the thermally stimulated current method. The presence of fillers affects the dielectric properties due to additional dielectric relaxation phenomena, which depend on the structure of the inorganic filler. Pores or cages existing in the zeolite frame enable their compensated ions to move away from their neutral position under electric field to form dipoles of very low activation energy and high attempt-to-escape frequency. The activation energy is related to the pore sizes of zeolites. However, kaolin-based clay which has movable cations on its surfaces form an interfacial dipole between the LDPE and clay. A `Maxwell-Wagner´ interfacial relaxation behavior was observed in the clay-filled LDPE system. The activation energy of interfacial relaxation of the clay-filled LDPE system is higher than that of dipole relaxation of the zeolite-filled LDPE
Keywords :
composite insulating materials; dielectric relaxation; filled polymers; organic insulating materials; polymer structure; space charge; thermally stimulated currents; LDPE; Maxwell-Wagner interfacial relaxation behavior; activation energy; aluminosilicate-filled low-density polyethylene; attempt-to-escape frequency; cages; charge storage; clay fillers; compensated ion movement; dielectric relaxation; dipole formation; dipole relaxation; inorganic filler structure; interfacial dipole; kaolin-based clay; movable cations; pores; space charge formation; thermally stimulated current; zeolite fillers; Additives; Chemicals; Dielectrics and electrical insulation; Frequency; Inorganic materials; Petroleum; Polyethylene; Polymers; Sheet materials; Space charge;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on