• DocumentCode
    1128827
  • Title

    A Microcontroller Instruction Set Simulator for EMI Prediction

  • Author

    Yuan, Shih-Yi ; Chung, Huai-En ; Liao, Shry-Sann

  • Author_Institution
    Dept. of Commun. Eng., Feng Chia Univ., Taichung, Taiwan
  • Volume
    51
  • Issue
    3
  • fYear
    2009
  • Firstpage
    692
  • Lastpage
    699
  • Abstract
    This paper predicts programspsila effect of time-domain electromagnetic interference (EMI) on a simple microcontroller. Using the instruction current concept and a modified instruction set simulator (ISS) for this purpose, this paper can predict, in the time domain, accurate conducted EMI behaviors when different programs are running on this system. Different program codespsila EMI behaviors are predicted, and all of these codes fit well with the measurement results. The modified ISS is adapted to estimate the pipeline effect of a microcontroller and to give an accurate current profile of any complex multi-instruction program. By using the instruction current model and the proposed ISS, this paper can predict the EMI behavior of a very complex program-a simple home-made operating system (OS) kernel. To the best of our knowledge, this paper is the first work on observation and prediction of EMI behavior of an embedded system OS kernel.
  • Keywords
    electromagnetic interference; instruction sets; microcontrollers; operating system kernels; electromagnetic interference prediction; microcontroller instruction set simulator; operating system kernel; pipeline effect; CMOS technology; Clocks; Electromagnetic compatibility; Electromagnetic interference; Frequency synchronization; Kernel; Microcontrollers; Operating systems; Power supplies; Predictive models; Electromagnetic analysis; electromagnetic compatibility (EMC); electromagnetic interference (EMI); modeling; operating system (OS) kernels;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2009.2022836
  • Filename
    5159532