Title :
The evolution of packages for monolithic microwave and millimeter-wave circuits
Author :
Midford, Thomas A. ; Wooldridge, John J. ; Sturdivant, Rich L.
Author_Institution :
Microwave Electron. Div., GM Hughes Electron., Los Angeles, CA, USA
fDate :
9/1/1995 12:00:00 AM
Abstract :
The maturing of monolithic microwave integrated circuit (MMIC) technology has spawned a variety of new military and commercial applications. As-a result, there is an increased emphasis on the packaging of MMIC chips and MMIC-based components. Currently, the industry is applying a number of new assembly and packaging technologies to RF components and subsystems driven by the forces of performance, size and weight, and cost. This paper outlines the current evolution in microwave and millimeter-wave packaging using examples drawn from the area of active array antennas
Keywords :
MIMIC; MMIC; active antenna arrays; antenna phased arrays; integrated circuit packaging; microwave antenna arrays; military equipment; millimetre wave antenna arrays; phased array radar; radar antennas; MMIC chips; MMIC technology; MMIC-based components; RF components; RF subsystems; active array antennas; active phased array radar; assembly technologies; commercial applications; cost; microwave packaging; military applications; millimeter-wave integrated circuits; millimeter-wave packaging; monolithic microwave integrated circuits; packaging; performance; size; weight; Application specific integrated circuits; Assembly; Defense industry; Integrated circuit packaging; Integrated circuit technology; MMICs; Microwave antenna arrays; Microwave integrated circuits; Microwave technology; Monolithic integrated circuits;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
