Title :
An Analytic Method for Capacitance Extraction of Asymmetric Vias
Author :
Guangran Zhu ; Thiel, Werner ; Bracken, J. Eric
Author_Institution :
ANSYS Inc., Canonsburg, PA, USA
Abstract :
This paper considers the problem of via-plane capacitance extraction for power and signal integrity analysis of printed circuit boards and electronic packages. The recently proposed full-wave method is extended to handle asymmetric antipads by judiciously selecting the integration domain of the magnetic field in the parallel-plate cavity. Numerical results demonstrate its agreement with the capacitance obtained from the quasi-static method.
Keywords :
electronics packaging; printed circuits; vias; asymmetric antipads; asymmetric vias; capacitance extraction analytic method; electronic packages; full-wave method; magnetic field; parallel-plate cavity; power integrity analysis; printed circuit boards; quasistatic method; signal integrity analysis; via-plane capacitance extraction; Admittance; Capacitance; Cavity resonators; Equivalent circuits; Integrated circuit modeling; Ports (Computers); Printed circuits; Circuit simulation; parameter extraction; signal integrity;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2015.2409795
