• DocumentCode
    1130291
  • Title

    Semi-Empirical Model-Based Multivariable Iterative Learning Control of an RTP System

  • Author

    Cho, Moonki ; Lee, Yonghee ; Joo, Sangrae ; Lee, Kwang Soon

  • Author_Institution
    Conwell Co. Ltd., Seoul, South Korea
  • Volume
    18
  • Issue
    3
  • fYear
    2005
  • Firstpage
    430
  • Lastpage
    439
  • Abstract
    Comprehensive study on control system design for a rapid thermal processing (RTP) equipment has been conducted with the purpose to obtain maximum temperature uniformity across the wafer surface, while precisely tracking a given reference trajectory. The study covers from model development, identification, optimum multivariable iterative learning control (ILC), to reduced-order controller design. The highlight of the study is the ILC technique on the basis of a semi-empirical dynamic radiation model named as T^4 -model. It was shown that the T^4 -model-based ILC technique can remarkably improve the performance of RTP control compared with the ordinary linear model-based ILC. In addition, reduced-order control methods and the associated optimum sensor location have been addressed. The proposed techniques have been evaluated in an RTP equipment fabricating 8-in wafers.
  • Keywords
    control system synthesis; optimal control; process design; rapid thermal processing; temperature control; RTP system; control system design; maximum temperature uniformity; rapid thermal processing; reduced order controller design; semi-empirical model based multivariable iterative learning control; wafer surface; Control systems; Error correction; Process control; Rapid thermal processing; Semiconductor device modeling; Temperature control; Temperature distribution; Temperature measurement; Thermal conductivity; Trajectory; Iterative learning control (ILC); RTP modeling; linear quadratic Gaussian (LQG); rapid thermal processing (RTP) control;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2005.852111
  • Filename
    1492459