• DocumentCode
    1130309
  • Title

    Long-wavelength two-dimensional WDM vertical cavity surface-emitting laser arrays fabricated by nonplanar wafer bonding

  • Author

    Geske, Jon ; Okuno, Yae L. ; Leonard, Devin ; Bowers, John E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
  • Volume
    15
  • Issue
    2
  • fYear
    2003
  • Firstpage
    179
  • Lastpage
    181
  • Abstract
    We demonstrate the first long-wavelength two-dimensional wavelength-division-multiplexed vertical cavity surface-emitting laser array. The eight-channel single-mode array covers the C-band from 1532 to 1565 nm. The devices are fabricated using two separate active regions laterally integrated using nonplanar wafer bonding. We achieved single-mode powers up to 0.8 mW, 2-dB output power uniformity across the array, and sidemode suppression ratios in excess of 43 dB. This fabrication technique can be used to maintain the gain-peak and cavity-mode alignment across wide-band arrays and, with the use of nontraditional mirrors, can be extended to the fabrication of arrays covering the entire C-, S-, and L-bands as well as the 1310-nm transmission band.
  • Keywords
    distributed Bragg reflector lasers; laser modes; laser transitions; optical fabrication; optical pumping; semiconductor laser arrays; wafer bonding; wavelength division multiplexing; 0.8 mW; 1310 nm; 1532 to 1565 nm; C-band; cavity-mode alignment; eight-channel single-mode array; gain-peak; laterally integrated; long-wavelength two-dimensional WDM vertical cavity surface-emitting laser arrays; nonplanar wafer bonding; optical pumping; separate active regions; sidemode suppression ratios; single-mode powers; wafer-scale integration; wide-band arrays; Fabrication; Mirrors; Optical arrays; Power generation; Surface emitting lasers; Surface waves; Vertical cavity surface emitting lasers; Wafer bonding; Wavelength division multiplexing; Wideband;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2002.806101
  • Filename
    1174112