• DocumentCode
    1130315
  • Title

    Locating Disturbances in Semiconductor Manufacturing With Stepwise Regression

  • Author

    McCray, Anthony T. ; McNames, James ; Abercrombie, David

  • Author_Institution
    Sun Microsystems, Hillsboro, OR, USA
  • Volume
    18
  • Issue
    3
  • fYear
    2005
  • Firstpage
    458
  • Lastpage
    468
  • Abstract
    The ability to locate disturbances in semiconductor manufacturing processes is critical to developing and maintaining a high yield. Analysis of variance (ANOVA), the best current practice for this problem, consists of conducting a series of hypothesis tests at each individual processing step. This approach can lead to excessive false alarms and limited sensitivity when the process contains more than one disturbance. We describe how this problem can be framed as a subset selection problem and propose two new methods based on stepwise regression. Results of over 90 000 Monte Carlo simulations suggest that these new SWR methods locate disturbances with fewer false positives and false negatives than ANOVA. This means process engineers will spend less time responding to false alarms and will be able to locate real disturbances more often.
  • Keywords
    Monte Carlo methods; covariance analysis; integrated circuit manufacture; process monitoring; regression analysis; statistical process control; ANOVA; Monte Carlo simulations; analysis of variance; disturbances location; semiconductor manufacturing process; statistical process control; stepwise regression; yield; Analysis of variance; Circuit testing; Electric variables measurement; Large scale integration; Logic; Manufacturing processes; Monitoring; Process control; Scheduling algorithm; Semiconductor device manufacture; Analysis of variance (ANOVA); fault isolation; semiconductor manufacturing; statistical process control and monitoring; stepwise regression; variance reduction; variance source isolation;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2005.852118
  • Filename
    1492462