A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology

Author

Jackson, K.P. ; Flint, E.B. ; Cina, M.F. ; Lacey, D. ; Kwark, Y. ; Trewhella, J.M. ; Caulfield, T. ; Buchmann, P. ; Harder, Ch. ; Vettiger, P.

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

12

Issue

7

fYear

1994

fDate

7/1/1994 12:00:00 AM

Firstpage

1185

Lastpage

1191

Abstract

An optoelectronic transceiver module is described consisting of a four-channel AlGaAs integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded to a substrate containing electrical wiring and planar-processed optical waveguides. The optical waveguide layer serves two purposes: the routing of optical signals, as well providing mechanical registrations for the optoelectronic chips and fiber-optic ribbon connector. The work described here demonstrates one approach to high-density, optoelectronic array packaging compatible with existing high-performance electronic packaging technology

Keywords

adhesion; field effect integrated circuits; integrated optics; integrated optoelectronics; optical communication equipment; optical waveguides; semiconductor lasers; soldering; transceivers; AlGaAs; AlGaAs integrated laser; GaAs; OEIC transceiver module; electrical wiring; fiber-optic ribbon connector; flip-chip; four-channel; four-channel GaAs MESFET; high-density; high-performance electronic packaging technology; integrated detector; mechanical registrations; monitor transmitter; optical signal routing; optical waveguide layer; optoelectronic array packaging; optoelectronic chips; optoelectronic transceiver module; planar-processed optical waveguides; preamp receiver; solder-bump bonded; solder-bump technology; Bonding; Electronics packaging; Gallium arsenide; Monitoring; Optical receivers; Optical transmitters; Optical waveguides; Optoelectronic devices; Transceivers; Waveguide lasers;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/50.301811

Filename

301811