A novel method for fabrication of a hybrid optoelectronic packaging platform utilizing passive-active alignment

Author

Datta, Madhumita ; Hu, Zhaoyang ; Dagenais, Mario

Author_Institution

Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA

Volume

15

Issue

2

fYear

2003

Firstpage

299

Lastpage

301

Abstract

We present a novel fabrication method for a hybrid optoelectronic packaging platform using a combination of passive and active alignment. V-grooves on a silicon optical bench facilitate coarse passive alignment, while on-board thin-film heaters enable final active alignment. The passive-active alignment technique ensures /spl sim/50% peak-coupling efficiency from a semiconductor laser diode with a single-mode conically lensed fiber, making it a low-cost packaging solution appropriate for a variety of optoelectronic modules.

Keywords

heating elements; hybrid integrated circuits; integrated optoelectronics; optical fabrication; optical fibre couplers; semiconductor device packaging; V-grooves; coarse passive alignment; fabrication method; final active alignment; hybrid optoelectronic packaging platform; on-board thin-film heaters; passive-active alignment; peak-coupling efficiency; semiconductor laser diode; silicon optical bench; single-mode conically lensed fiber; Optical coupling; Optical device fabrication; Optical fiber devices; Optical fibers; Optical films; Optical interferometry; Optical wavelength conversion; Semiconductor device packaging; Semiconductor thin films; Silicon;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2002.806090

Filename

1174152