Title :
Toward a More Robust and Accurate CEM Fast Integral Equation Solver for IC Applications
Author :
Chew, Weng Cho ; Jiang, Li Jun ; Chu, Yun Hui ; Wang, Gong Li ; Chiang, I-Ting ; Pan, Yuancheng C. ; Zhao, Jun Sheng
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois, Urbana, IL, USA
Abstract :
We review recent advances in fast algorithms for fast integral equation solvers that are useful for IC applications. We review fast solvers for Laplace´s equation, which is about 10 times faster than the conventional fast multipole method. Then we review the physics of low-frequency electromagnetics, and the relevant low-frequency method of moments. We describe a fast solver that allows us to solve over one million unknowns on a workstation recently. In addition, we demonstrate the applications of these fast integral equation solvers to the lithography problem. In addition, we propose a scheme whereby we first characterize blocks of linear circuits with network S, Y, or Z parameters. Then a fast real-time convolution scheme is used to calculate the interaction of a linear circuit with nonlinear terminations such as transistors and diodes. Such a scheme requires no model-order reduction of the circuits.
Keywords :
Laplace equations; S-parameters; computational electromagnetics; integral equations; linear network analysis; lithography; method of moments; CEM fast integral equation solver; Laplace equation; fast real-time convolution scheme; integrated circuit applications; linear circuits; lithography problem; low-frequency electromagnetics; low-frequency method of moments; model-order reduction; multilevel fast multipole method algorithm; nonlinear terminations; Application specific integrated circuits; Electromagnetics; Integral equations; Laplace equations; Linear circuits; Lithography; Moment methods; Physics; Robustness; Workstations; Fast real-time convolution; integral equation; lithography; method of moments (MoM); multilevel fast multipole algorithm (MLFMA);
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2005.848665