DocumentCode
1130788
Title
Toward a More Robust and Accurate CEM Fast Integral Equation Solver for IC Applications
Author
Chew, Weng Cho ; Jiang, Li Jun ; Chu, Yun Hui ; Wang, Gong Li ; Chiang, I-Ting ; Pan, Yuancheng C. ; Zhao, Jun Sheng
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois, Urbana, IL, USA
Volume
28
Issue
3
fYear
2005
Firstpage
449
Lastpage
464
Abstract
We review recent advances in fast algorithms for fast integral equation solvers that are useful for IC applications. We review fast solvers for Laplace´s equation, which is about 10 times faster than the conventional fast multipole method. Then we review the physics of low-frequency electromagnetics, and the relevant low-frequency method of moments. We describe a fast solver that allows us to solve over one million unknowns on a workstation recently. In addition, we demonstrate the applications of these fast integral equation solvers to the lithography problem. In addition, we propose a scheme whereby we first characterize blocks of linear circuits with network S, Y, or Z parameters. Then a fast real-time convolution scheme is used to calculate the interaction of a linear circuit with nonlinear terminations such as transistors and diodes. Such a scheme requires no model-order reduction of the circuits.
Keywords
Laplace equations; S-parameters; computational electromagnetics; integral equations; linear network analysis; lithography; method of moments; CEM fast integral equation solver; Laplace equation; fast real-time convolution scheme; integrated circuit applications; linear circuits; lithography problem; low-frequency electromagnetics; low-frequency method of moments; model-order reduction; multilevel fast multipole method algorithm; nonlinear terminations; Application specific integrated circuits; Electromagnetics; Integral equations; Laplace equations; Linear circuits; Lithography; Moment methods; Physics; Robustness; Workstations; Fast real-time convolution; integral equation; lithography; method of moments (MoM); multilevel fast multipole algorithm (MLFMA);
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2005.848665
Filename
1492514
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