DocumentCode :
1131227
Title :
Next generation digital GPS receiver
Author :
Frank, G.B. ; Yakos, M.D.
Author_Institution :
Rockwell Int., Cedar Rapids, IA, USA
Volume :
5
Issue :
7
fYear :
1990
fDate :
7/1/1990 12:00:00 AM
Firstpage :
10
Lastpage :
15
Abstract :
The architecture and technology features of the next-generation (NGR) digital GPS (Global Positioning System) receiver manufactured by Collin are described. The project´s objective was to develop an advanced GPS receiver chipset with high antijam capabilities. The program, initiated in 1985, has provided the technology for miniature receiver products for both unmanned and manned vehicle applications. A two-channel version of the receiver is in full-scale development for tactical missile applications. A five-channel version is being tested and evaluated as a drop-in replacement for RCVR-3A, the US Department of Defense standard high dynamic receiver. The NGR design started with the digital signal processing architecture developed for the Defense Advanced Research Project Agency (DARPA) hand-held GPS receiver. Enhancements were made to improve the antijam and signal acquisition performance. Producible, qualifiable and cost-effective silicon monolithic microwave integrated circuits and semicustom digital technologies were used to develop the core GPS chipset. A system design approach was established to permit reuse of mature and validated GPS software.<>
Keywords :
MMIC; digital signal processing chips; electronic countermeasures; military equipment; radio receivers; radionavigation; satellite relay systems; signal processing equipment; Collin; DARPA; Defense Advanced Research Project Agency; ECM; Global Positioning System; Si; US Department of Defense; antijam capabilities; digital GPS receiver; digital signal processing architecture; five-channel receiver; hand-held receiver; miniature receiver; monolithic microwave IC; radionavigation; semicustom digital technologies; signal acquisition; tactical missile applications; two-channel receiver; Digital signal processing chips; Global Positioning System; MMICs; Manufacturing; Microwave integrated circuits; Missiles; Signal design; Silicon; Testing; Vehicle dynamics;
fLanguage :
English
Journal_Title :
Aerospace and Electronic Systems Magazine, IEEE
Publisher :
ieee
ISSN :
0885-8985
Type :
jour
DOI :
10.1109/62.134215
Filename :
134215
Link To Document :
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