DocumentCode :
1132761
Title :
Analysis of the Influence of Substrate on the Performance of On-Chip MOS Decoupling Capacitors
Author :
Rius, Josep ; Meijer, Maurice
Author_Institution :
Dept. d´´Eng. Electron., Univ. Politec. de Catalunya, Barcelona
Volume :
44
Issue :
2
fYear :
2009
Firstpage :
484
Lastpage :
494
Abstract :
The interaction between substrate and devices is normally neglected during the design of on-chip MOS decoupling capacitors (decaps). However, it may significantly influence the decap performance to reduce high-frequency power supply noise. In this paper we propose a novel six-parameter analytical decap model which accounts for substrate and device interactions. Our model has been compared against state-of-the-art decap models. Moreover, it has been extensively validated through simulations and measurements. For 65 nm LP-CMOS, a close correlation has been obtained over a large frequency range from 10 MHz up to 10 GHz. Furthermore, we introduce the maximum decap admittance as a new metric for decap performance qualification. Closed-form expressions have been derived to calculate maximum admittance. Finally, we determine the relationship between relevant figure-of-merit parameters for decap design optimization.
Keywords :
CMOS integrated circuits; MOS capacitors; LP-CMOS; closed-form expressions; decap performance qualification; figure-of-merit parameters; frequency 10 MHz to 10 GHz; high-frequency power supply noise reduction; on-chip MOS decoupling capacitors; size 65 nm; Admittance; Analytical models; Closed-form solution; Design optimization; Frequency; MOS capacitors; Noise reduction; Performance analysis; Power supplies; Qualifications; Distributed parameter circuit; on-chip decoupling capacitor; wafer substrate;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2008.2010806
Filename :
4768886
Link To Document :
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